Rudolph Technologies to Participate in the D.A. Davidson & Co. 7th Annual Technology Forum Investor Conference May 27, 2015
Rudolph Technologies, Inc. (NYSE:RTEC) , a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced that Paul F. McLaughlin, the Company’s Chairman and Chief Executive Officer, will participate in the D.A. Davidson & Co. 7th Annual Technology Forum Investor Conference. Mr. McLaughlin will present Wednesday, May 27, 2015 from 8:15 to 8:55 AM EDT, with one-on-one meetings held throughout the day. The conference will be held at The Grand Hyatt Hotel, New York, New York.
For additional information or to schedule a one-on-one meeting, please contact your D.A. Davidson & Co. contact.
About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.
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